Thermal conduction in a densified oxide glass: Insights from lattice dynamics

Water dynamics in cement paste : insights from lattice Boltzmann modelling

Transport properties are often used as indicators of durability because water underpins most of the degradation mechanisms of concrete structures. The objective of this thesis is to understand the link between the microstructure and the permeability of cement paste, the binder phase of concrete. To achieve this goal, the lattice Boltzmann method is used to simulate the flow through three-dimens...

A review on the flexural mode of graphene: lattice dynamics, thermal conduction, thermal expansion, elasticity and nanomechanical resonance.

Single-layer graphene is so flexible that its flexural mode (also called the ZA mode, bending mode, or out-of-plane transverse acoustic mode) is important for its thermal and mechanical properties. Accordingly, this review focuses on exploring the relationship between the flexural mode and thermal and mechanical properties of graphene. We first survey the lattice dynamic properties of the flexu...

Thermal conduction in lattice–matched superlattices of InGaAs/InAlAs

Brittle to Ductile Transition in Densified Silica Glass

Current understanding of the brittleness of glass is limited by our poor understanding and control over the microscopic structure. In this study, we used a pressure quenching route to tune the structure of silica glass in a controllable manner, and observed a systematic increase in ductility in samples quenched under increasingly higher pressure. The brittle to ductile transition in densified s...

Thermal Resistance of Silicon/germanium Interfaces from Lattice Dynamics Calculations

INTRODUCTION Phonon scattering at the interface between two materials results in a thermal resistance, R [1]. An ability to accurately predict the thermal resistance of semiconductor interfaces is important in devices where phonon interface scattering is a significant contributor to the overall thermal resistance (e.g., computer chips with high component density). This ability will also lead to...